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Integration Trend Of Touch And Driver IC Rise
Beijing June 17 news, China touchscreen Reuters, the international touch IC maker, Synaptics announced acquisition of the panel driver IC supplier with US $ 470 millions, RenesasSPDrivers, which is another marry case of industry pile touch IC factory and driver IC plant following the previous merger of Duntai Adn Xu Yao. Global market research firm,TrendForce said a similar spate of mergers and acquisitions will TDDI the integration of the road opened a new page. TDDI proposed concept has been for some time, in this framework, in addition to lower costs by reducing the use of IC, but also helps to simplify circuit design and reduce development time; for the customers, because the supply chain to be integration's sake, can be improved procurement system management efficiency. However, due to the current touch panel driver IC and the IC business resources belonging to different ethnic groups in the hands of manufacturers, coupled with high panel factory driver IC for the development and follow-on order to grasp the degree of resources, resulting in the promotion of TDDI always faced with no small obstacle. TrendForce pointed out that the development of the most favorable direction TDDI three. First, the white-box handset panel glass, touch module IC components and other related resources are mostly concentrated in the small and medium-size panel module manufacturers in South China are integrated in the supply chain infrastructure such sui generis, these modules manufacturers with the promotion of the public version of framework conditions and product capabilities, while effective CostDown TDDI offer the ability to help optimize the problem of white-box handset manufacturers are very important, but also easy to evoke the natural resonance of the module manufacturers. Followed by less frequent design changes for products to AppleiPhone smart phone, for example, have stabilized in recent years, with an annual frequency introduction of new products, the longer product life cycle, cumulative shipments of more massive, all help lower amortization of development costs per unit, this way it can bring TDDI cost advantage. Unfortunately, currently on the market in addition to the Android system for the bulk of the smart phone products, due to the change of generations shortened, resulting in the revision panel and touch module speed increasingly frequent, in this context, TDDI compared to traditional touch IC and driver IC separate independent architecture compared to manifest advantages become relatively limited. Finally, there is a focus panel factory recently active promotion of the product on the touch panel integration stage Taiwan panel makers Innolux, AUO and CPT and so will focus on the development of On-cell architecture, and Korean-Japanese LGD and JDI bets in more complex structure on the In-cell. For panel makers, whether In-cell or On-cell, is an important weapon to snatch pie touch performance, which integrates touch with the driver IC is the inevitable trend of long-term development. These products provide the best environment for the development as good stage TDDI, have the opportunity to become TDDI popularize primary blocks.
    
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